Configuration range
Built around your device and measurement.
The Auto-Probe platform coordinates motion, optics, alignment, chuck control and electrical instrumentation so engineers can move from an approved manual test sequence to a repeatable automated workflow.
System highlights
- 200 mm and 300 mm platforms
- Automated alignment and wafer mapping
- High-power and thermal configurations
- Programmable motion and instrument control
Application fit
- Wafer-level characterization
- Reliability and engineering lots
- Automated die probing
- Repeatable production-adjacent workflows