
Manual systems
VERSA
A modular double-sided probing platform for wafers, die, packages and boards—configured around the measurement, not the other way around.
- 200–450 mm configurations
- DC, IV/CV, RF & mmW
- Thermal & dark-test ready
Micron ProbingPrecision test systemsConfigure a systemComplete semiconductor test environments
Probe stations, analyzers, thermal systems, photonics automation and radiation testing—integrated around your devices, measurements and lab.

One partner from probe tip to data
Featured systems
Real platforms from the Micron Probing portfolio, presented clearly so your team can compare the right starting points.

Manual systems
A modular double-sided probing platform for wafers, die, packages and boards—configured around the measurement, not the other way around.

Automated systems
Precision motorized probing with pattern recognition, programmable motion and repeatable wafer-level measurement workflows.

Low-temperature research
Integrated flow and closed-cycle environments for quantum, MEMS, nanoscale and electro-optical characterization.

Radiation qualification
An integrated X-ray irradiation platform for controlled Total Ionizing Dose testing of semiconductor wafers, ICs and electronic components.

Optical & electro-optical
Automated, high-precision optical alignment platforms for photonic integrated circuits from individual die through 300 mm wafers.

Source & measurement
Semiconductor characterization instruments paired with the station, cabling and switching architecture your measurement requires.

General-purpose probing
A compact, value-focused manual probing platform for daily device work, education, R&D and straightforward characterization.

Automated inspection
A high-throughput optical inspection platform with automated motion, precision alignment and production-ready wafer mapping.
Application range
Every cable, probe, chuck, enclosure and instrument affects the result. We configure the whole path as one test environment.
Start a configurationLow-current, guarded and triax measurement paths for repeatable device characterization.
Station, probe, cable and calibration integration for high-frequency work through 110 GHz.
Interlocked configurations for high-voltage and high-current semiconductor evaluation.
Ambient through extended-temperature chuck systems for characterization from −65 to 400 °C.
Electrical and optical alignment brought together for die-to-300 mm photonics workflows.
Controlled X-ray irradiation and in-situ electrical measurement for component qualification.
System integration
Micron Probing pairs the mechanical platform with positioners, optics, thermal control, shielding, analyzers, cabling and software. The result is a system designed to work together from installation.
Start your system
Share the device format, electrical range, temperature, frequency and throughput. We’ll help build the right configuration.