Automate your Semiconductor Testing
Automation
Semiconductor testing has a variety of steps and Micron probing strives to offer the finest automated solutions for your semiconductor needs.
EDS15 is a fully automated and high speed die sorter. It can handle any wafer sizes up to 300mm and can reconstruct wafers to different output form factor.
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Key features of EDS-15 Die Sorter:
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Handles wafer sizes up to 300mm
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Machine throughput up to 20,000 UPH
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Ability to handle die size of 04×02 mm or larger
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SideWall Inspection capability with Estek proprietary special design lighting
EDS15 is used for wafer to wafer sorting application with turret pick and place mechanism. The Die Sorter EDS15 offers ultimate performance with versatility, flexibility and can handle the most challenging application for die sorting.
Specifications
Facilities
Voltage - 415V, 3 phase, 10A
Vacuum - 80kPa @ 500L/min
Temperature - 20 ~ 30°C
Humidity - 18 - 70% RH Non-Condensing
CDA - 6 Bar 200L/M
Vision Capabilities
Input Vision
Sidewall Vision Right
Top Vision
Sidewall Vision Top
Aligner Vision
Sidewall Vision Bottom
Bottom Vision
Output Vision
Sidewall Vision Left
Setup Vision
System Capability
UPH up to 10k
Number of Pick Up Head 24
Packages
WLCSP
Input Module
Up to 12"Wafer
Output Module
Up to 6"Wafer
The EWS100 is a wafer inspection platform that leverages on ESTEK innovative Vision Technology. It delivers high-throughput and precision wafer-level and tile inspection.
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Advanced Motion couple with our vision systems provide dramatically improved positioning and alignment capability. User-friendly software improves efficiency and provides compatibility.
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Estek provides dedicated inspection solutions to address the special requirements for LED manufacturing process
Specifications
Facilities
Voltage - 220VAC Single Phase
Frequency - 50/60 Hz
Power Comsumption - 2.4KVA
Temperature - 20 ~ 30°C
Humidity - 18 ~70% RH Non-Condensing
CDA - 6 Bar 200L/M
Camera
25M Color Camera
100M Color Camera with Pixel Shifting Technology
2um Resolution
Lens
Tele centric Lens
Lightings
Full Color RGB
Co-axial
Back Light
Wafer System
Wafer Size
4", 6", 8" and 12"
Wafer Handling
Gripper
Conversion time (Standard)
15 mins
Packages
Dimension (W x D x H)
1500 x 1200 x 2000mm
(For 8" Wafer Only)
Weight (Net)
1300kg
Vision GUI - Mapping
Specifications
Facilities
Voltage
220VAC Single Phase
Frequency
50/60 Hz
Power Comsumption
2.4KVA
Temperature
20 ~ 30°C
Humidity
18 ~70% RH Non-Condensing
CDA
6 Bar 200L/M
Camera
25M Color Camera
100M Color Camera with Pixel Shifting Technology
2um Resolution
Lens
Tele centric Lens
Lightings
Full Color RGB
Co-axial
Back Light
Wafer System
Wafer Size
4", 6", 8" and 12"
Wafer Handling
Gripper
Conversion time (Standard)
15 mins
Packages
Dimension (W x D x H)
1500 x 1200 x 2000mm
(For 8" Wafer Only)
Weight (Net)
1300kg
Vision GUI - Mapping
EWS100
Advanced Optical Inspection
UDM100
De-panelling System Smart Solution
Estek offers solutions for the entire spectrum for Integrated circuit depaneling operation. Our product range focuses on modern processes in electronic component production.
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Depaneling system from Estek provide high-performance depaneling process which utilize ultrasonic technique for separating electronic components from wafer tape. The technique and principles we use are fast, reliable, and low-stress, and ensure maximum productivity and quality.
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Specifications
Facilities
Voltage -240VAC Single Phase
Frequency - 50/60 Hz
Power Consumption - 2.4KVA
Temperature - 20 ~ 30°C
Humidity - 18 ~ 70% RH Non-Condensing
CDA - 6 Bar 200L/M
Wafer Ring Handling
Wafer Ring Size
8" and 12"
Ring Handling
Gripper
Conversion Time (Standard)
5 mins
Dimension and Weight
Dimension (W x D x H)
1500 x 1000 x 2000mm
Weight (Net)
1000kg
Chamber
ESD Material
YES
ESD Air Circulation
YES
Canister Size
1.5" width & 3" width
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TS201
Turret-Based Test Handler
Estek offers turret-based Vision Inspection and back-end finishing process equipment for LED, ICs and discrete components to the semiconductor industry.
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The technology and innovation used in Estek products is the best solution with high modularity and high value return to customers.
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Specifications
Facilities
Voltage - 240VAC Single Phase
Frequency - 50/60 Hz
Power Consumption - 2.4KVA
Temperature - 20 ~ 30°C
Humidity - 18 ~ 70% RH Non-Condensing
CDA - 6 Bar 200L/M
Dimension and Weight
Dimension (W x D x H)
1900 x 1500 x 2000mm
Weight (Net)
1500kg
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With years of research and development, the EWS300 was developed based on the decade of experience in automation process resulting in the development of our state of art product, with the groundbreaking features that bring the product to a new level of simplicity, reliability and speed for automatic optical inspection solution.
Specifications
Inspection
Inspection Capabilities
Detecting wafer cosmetic defect, measurement, ink dot for wafer, probe mark & etc.
Recipe / Setup (On and Off-Line)
Automatic “golden die” image generation from production wafer.
Interactive graphical tools for various zone definition.
User-defined detection parameters per defects and zones.
Resolution
Changeable with multiple lens, up to 0.35µm per pixel.
Accuracy
Up to 0.7µm.
Represents deviation between average of the distribution of results of repeated measurements of golden target and it certified value.
Repeatability
Up to 0.7µm at 3 sigma.
Represents 3 sigma deviation value of the distribution of results of repeated measurements of the same real component.
Minimum Defect Detection
Up to 1µm.
System Configuration
Factory Automation
Secs/Gem
Cleanliness
Class 100/1000
Particles removal system
Hepa System
Output
Output Data
Wafer Map, SPC Analysis Report, KLARF
Machine layout
Dimension
L1620 x W2235 x H1950mm
Wafer Handling
Wafer ID Reading capability: SEMI M12, M13, M1.15, T1.95
OCR ECC200, T7 DtaMatrix, QR-Code BC412, IBM412
Wafer Type -Wafer & Film Frame Wafer
Supported Wafer Size
6", 8" & 12"
Wafer Cassettes
Standard Cassettes: Entegris, Empak or Fluoroware (FOUP Optional)
Wafer Handling
Twin Arms Wafer Robot with Slot Sensor (Mapping)
Analytical Probe Stations
Design and implement testing programs for devices from the wafer level to the product level. Automate you most precise testing needs at .1 micron scale.
Software
Optical and analytical software solutions for all your semiconductor needs.